CHO-BOND 1075

Is used both for bonding EMI gaskets and for providing EMI shielding and environmental protection as a caulk. It is specifically recommended for bonding CHO-SEAL 1285 conductive elastomer gaskets (silver-plated-aluminum filled silicone). 

Cho Bond 1025 Data Sheet (PDF)

Binder SILICONE
Filler Ag/Al
Mix Ratio (by wgt.) 1-part
Consistency medium paste
Specific Gravity 2.0 ±0.25
Minimum Lap Shear Strength, psi (MPa) 100 (0.69)
Minimum Die Shear* Strength, psi (MPa)
Maximum DC Volume Resistivity, ohm-cm 0.01
Use Temperature –67 to 392°F (–55 to 200°C)
Elevated Temperature Cure Cycle NA
Room Temperature Cure 1 wk.***
Working Life 0.25 hr.
Shelf Life, mos. 6
Coverage, in.2/lb. (cm2/g) 1,200 (17.0)
Recommended Thickness, in. (mm) 0.010 min. (0.25)
VOC, g/liter 0
* Alumina die on gold
** at -40°F (-40°C)
NA Not Applicable
Product Partnumber Unitsize Price In Stock
50-02-1075-0000 CHO-BOND 1075 2.5 ounce kit (71 g) RFQ Only Yes
50-01-1075-0000 CHO-BOND 1075 10 ounce kit (0.3 kg) RFQ Only Yes